封装尺寸
封装类型
感量
共模阻抗
厚度
温升电流
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| 图片 | 料号 | 封装尺寸 | 封装类型 | 感量 | 共模阻抗 | 厚度 | 温升电流 | 下载 |
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CMB2210SG181N | 31.5x28.0mm | SMT | 180uH | 400 Min(0.7MHZ) | 19.0mm | 32A |
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CM9R8DG103U | 16.5x12.0mm | DIP | 10mH | 15000 Min(0.7MHZ) | 16.5mm | 0.5A |
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CM15R7DG503U | 22.0x20.0mm | DIP | 50mH | 75000 Min(0.20MHZ) | 28.5mm | 2.0A |
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CM422SG8R0U | 6.4x9.5mm | SMT | 8.0uH | 800 Min(200MHZ) | 5mm | 1.5A |
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CM1385SG771N | 17.0x19.5mm | SMT | 770uH | 2000 Min(3MHZ) | 10.0mm | 4.7A |
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CM10R5DG303U | 19.0x17.0mm | DIP | 30mH | 25000 Min(0.25MHZ) | 22mm | 0.9A |
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CM633SG332N | 9x8.4mm | SMT | 3.3mH | 18000 Min(2MHZ) | 5.6mm | 0.52A |
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CM0903SG392N | 12.7x12.7mm | SMT | 3900uH | 1500 Min(2MHZ) | 5.46mm | 0.85A |
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CMB2210SG321N | 31.5x28.0mm | SMT | 320uH | 750 Min(0.9MHZ) | 19.0mm | 25A |
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CM15R7DG203U | 22.0x20.0mm | DIP | 20mH | 20000 Min(0.3MHZ) | 28.5mm | 3.0A |
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